Success in adhesive bonding of components requires careful control of the bonding process, surface condition and an understanding of the operating environment. Forensic analysis forms an important part both in the optimisation of bonding processes, understanding the factors that affect bond quality, and in the evaluation of bond failures.
The situations where forensic analysis may be used in practice include the following:
1. Failure investigations - Failure of bond
2. Following proof testing
3. As part of design, procedure and method optimisation
4. Following inspection and monitoring to evaluate bond condition
Please click the links below to view the relevant case studies
