Physical

Creep Tests

BS 5131–1.1 (1991): Methods of Test for Footwear and Footwear Materials. Adhesives. Resistance of Adhesive Joints to Heat (Creep Test)

This Section of BS 5131 describes a laboratory test method for measuring the heat resistance of a bonded joint. The main purpose of the method is to compare adhesives and as a consequence recommendations are given as to appropriate adherends. The most common application is the comparison of sole-attaching adhesives, but other types of adhesives may also be compared using this method. In addition, the method may be used for testing any other combination of materials in a bonded assembly, provided at least one of the adherends is flexible. Joints prepared by the direct bonding of hot melt adhesives are outside the scope of this method, since these joints would require a much higher temperature than that given in the method to soften the adhesive.

Note 1: The temperatures involved in the test are considered to represent the maximum temperatures likely to be encountered by footwear in normal use. The method can thus be applied to any adhesive to check suitability for use, but would not normally be applied to high melting point adhesives, such as hot melt lasting adhesives, which are used in direct bonding at higher temperatures.

Note 2: The two adherends are subjected to a constant separating force, and therefore in principle the test specimen may remain intact.

BS 5131–1.3 (1991): Methods of Test for Footwear and Footwear Materials. Adhesives. Preparation of Test Assemblies Using Adhesives (Other than Hot Melt Adhesives) for Heat Resistance (Creep) and Peel Tests

This section of BS 5131 describes methods for preparation of the test assemblies required by BS 5131–1.1 and BS 5131–1.2 for determination, respectively, of the resistance of bonded joints to heat (creep tests) and to peeling. BS 5131–1.3 includes methods for preparation of the adhesive and of the adherends. It covers most types of bonding used in the footwear industry except hot melt adhesive bonds, which are covered in BS 5131–1.7.

The types of bonds include stuck on bonds made by the use of applied adhesives (both solvent-based and water-based), injected-on bonds using thermoplastic sole materials, e.g. polyvinylchloride (PVC), thermoplastic rubber and moulded-on direct vulcanised rubber sole bonds. The methods of preparation are applicable to a wide variety of combinations of materials, but the peel and creep tests of BS 5131–1.1 and BS 5131–1.2 require at least one adherend to be flexible.

BS 5131–1.6 (1979): Methods of Test for Footwear and Footwear Materials. Adhesives. Recommended Environmental Storage Conditions for Adhesive Joints Prior to Heat Resistance or Peeling Tests

The performance of adhesive bonds in footwear may deteriorate in storage or in wear because of the adverse effect of environmental conditions, such as natural ageing or wetting. This part of BS 5131 describes a number of environmental storage conditions which may be used in the laboratory for the treatment of prepared adhesive joints in order to simulate the deterioration, which may occur in practice.

BS 5131–1.7 (1991): Methods of Test for Footwear and Footwear Materials. Adhesives. Preparation of Test Assemblies Using Hot Melt Adhesives for Heat Resistance (Creep) and Peel Tests

This part of BS 5131 describes methods for the preparation of test assemblies with various forms of hot melt adhesive by methods which simulate their use in shoe manufacturing for sole attaching, adhesive lasting and the laminating upper components.

Where the test assemblies are prepared by indirect bonding, they are intended for use in either the resistance to heat (creep test) described in BS 5131–1.1 or the resistance to peeling test described in BS 5131–1.2. However, where the test assemblies are prepared by direct bonding, they are intended for use in BS 5131–1.2 only, since the temperature given in BS 5131–1.1 is not sufficient to soften the adhesive.

The methods of preparation are applicable to a wide variety of combinations of adhesives and materials, but the peel and creep tests of BS 5131–1.1 and BS 5131–1.2 require at least one adherend to be flexible.

BS 5350-C7 (1990): Methods of Test for Adhesives. Adhesively Bonded Joints: Mechanical Tests. Determination of Creep and Resistance to Sustained Application of Force

This Part of BS5350 describes the application of test methods in which force is applied to an adhesive bond to determine displacement under constant force, creep and time to failure. In such applications, the tests are of necessity over extended periods and are, therefore, not normally used as batch control tests. This test is not intended to be used for obtaining data for design purposes.

Viscosity Tests

Physical Properties - Other Tests

BS 5350-H2 (1982): Methods of Test for Adhesives. Physical Tests on Hot-Melt Adhesives. Determination of Low Temperature Flexibility or Cold Crack Temperature

This part of BS5350 describes a procedure for determining whether a film of adhesive of specified dimensions will craze, crack or fracture at a specified temperature. Alternatively, the temperature at which the film will craze, crack or fracture is determined. The test is carried out either as a pass/fail test or at successively lower temperatures until failure occurs.

BS 5350-H3 (1984): Methods of Test for Adhesives. Physical Tests on Hot-Melt Adhesives. Determination of Heat Resistance of Hot-Melt Adhesives

This part of BS 5350 describes a method for determining whether a film of adhesive of specified dimensions will craze, crack or fracture at a specified temperature. Alternatively, the temperature at which the film will craze, crack or fracture is determined. The test is carried out either as a pass/fail test or at successively lower temperatures until failure occurs.

BS EN 61006 Part 0 (1993): Methods of Test for Determination of the Glass Transition Temperature of Electrical Insulating Materials

This international standard specifies tests for the determination of the glass transition temperature of solid electrical insulating materials. The tests are applicable to amorphous materials or to partially crystalline materials containing amorphous regions, which are stable and do not undergo decomposition or sublimation in the glass transition region.