Success in adhesive bonding of components requires careful control of the bonding process, surface condition and an understanding of the operating environment. Forensic analysis forms an important part both in the optimisation of bonding processes, understanding the factors that affect bond quality, and in the evaluation of bond failures.
The situations where forensic analysis may be used in practice include the following:
1. Failure investigations - failure of bond
2. Following proof testing
3. As part of design, procedure and method optimisation
4. Following inspection and monitoring to evaluate bond
The Forensics Module is designed to offer advice on methods of forensic analysis for adhesive bonds, process and procedures. This is supplemented by a number of examples and case studies to illustrate the information that may be gained from such analysis.
It is anticipated the number of examples will increase as the module is used. The module will also help identify gaps in present forensic practice and where recommended practice documents or improved or generic procedures and standards may be helpful to industry.
Please click the following links to go to the different parts of the forensic analysis module:
1. How to do a Forensic Analysis
3. Methods of forensic analysis
4. Reasons to undertake forensic analysis
5. Procedures and recommended practice
Forensic analysis of adhesive bonds may include visual examination, metallurgical examination, destructive examination such as sectioning, and the application of non-destructive evaluation NDE methods. The use of testing may be applicable to understand the bond quality.
Where failure has occurred then standard failure analysis methods may be necessary including the careful protection and quaranteeing of affected parts. In a number of industries approved repair procedures have been developed to remedy situations that may arise in service.
